Products

High-Density Scalable ASIC Prototyping Platform

TB-6V-LX760-LSI

Part Number: TB-6V-LX760-LSI

The inrevium TB-6V-LX760-LSI incorporates a Virtex-6 LX760 FPGA which features maximum density, high speed internal logic and high bandwidth interface. These features allow the TB-6V-LX760-LSI to combine higher bandwidth and performance with lower power consumption. With high-speed memory (DDR3 SDRAM 1066 Mbps) and a USB interface included as standard features together with support for a DDR memory controller and the standard DDR PHY interface (DFI), the new TB-6V-LX760-LSI is an ideal test platform for developing the LSIs that will serve as the core device in products featuring the next generation of high-quality image processing engines or video and communications control engines.

Features
Block Diagram
Documentation
Ordering Information

FPGA
- Xilinx FPGA: XC6VLX760-2FFG1760 device
Memory
- 4 x DDR3 SDRAM 1Gbit
- BPI flash 256 Mbit
- SPI flash 64 Mbit
Others
- Configuration:
  - Configuration from SD card
- Interfaces
  - USB 2.0
  - I2C
- Option connectors: FMC x 10
  - FMC LPC (low pin count) connectors x 10
    (Note: Not all of the LPC pins connect to the FPGA.)
    (Note: RoketIO is not connected.)
- Push button switches x 4
- LED x 16
- DIPO switches x 8
- Power supply
Reference Design (Verilog HDL)
- High-speed DDR3 SDRAM SO-DIMM interface design

User Guide
Virtex-6 FPGA Data Sheet
(Xilinx Website : Data Sheet page)
High-Density Scalable ASIC Prototyping Platform Product Brief

Part number	TB-6V-LX760-LSI
Deliverables	Power Supply Hardware User Guide Schematic Reference Design

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